Chamber for uniform heating of large area substrates
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United States of America Patent
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Oct 28, 2008
Grant Date -
Aug 3, 2006
app pub date -
Apr 3, 2006
filing date -
May 12, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Embodiments of the present invention generally provide an apparatus for providing a uniform thermal profile to a plurality of large area substrates during thermal processing. In one embodiment, an apparatus for thermal processing large area substrates includes a chamber having a plurality of processing zones disposed therein that are coupled to a lift mechanism. The lift mechanism is adapted to vertically position the plurality of processing zones within the chamber. Each processing zone further includes an upper heated plate, a lower heated plate adapted to support a first substrate thereon and an unheated plate adapted to support a second substrate thereon, wherein the unheated plate is disposed between the upper and lower heated plates.
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