Matrix form semiconductor package substrate having an electrode of serpentine shape
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United States of America Patent
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Oct 28, 2008
Grant Date -
Oct 10, 2002
app pub date -
Apr 5, 2001
filing date -
Apr 5, 2001
priority date (Note) -
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Abstract
A matrix form semiconductor package substrate that has an electrode situated in-between a plurality of IC package substrates for providing electrical communication to conductive pads on the substrate is provided. The matrix form semiconductor package substrate includes a plurality of IC package substrates that are integrally formed on a strip in a matrix pattern that has a boundary between each two of the plurality of IC package substrates. Each of the plurality of IC package substrates has a multiplicity of conductive pad traces and an electrode, or a plating bar, formed in a serpentine configuration along the boundary for providing electrical communication to the multiplicity of conductive pads.
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