Thin silicon based substrate

United States of America Patent

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Oct 28, 2008
Grant Date
Aug 24, 2006
app pub date
Mar 23, 2006
filing date
Oct 11, 2004

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Abstract

Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.

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Patent Owner	Address
INTEL CORPORATION	SANTA CLARA CA

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Muthukumar, Sriram	Chandler, AZ	42	634
Natekar, Devendra	Chandler, AZ	20	617

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Thin silicon based substrate

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United States of America Patent

11388354

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PATENT NO	7443030
APP PUB NO	20060189121A1
SERIAL NO	11388354
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 28, 2008	US,7443030,B2 US7443030B2	GRANTED PATENT AS SECOND PUBLICATION
August 24, 2006	US,20060189121,A1 US20060189121A1	FIRST PUBLISHED PATENT APPLICATION

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11388354

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