Packaging of a microchip device
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United States of America Patent
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Oct 28, 2008
Grant Date -
Nov 24, 2005
app pub date -
Jun 19, 2002
filing date -
Jan 15, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are located on the surface of the microchip devices. Electrical contacts on the microchip device surface are accessible through the aperture in order to electrically connect the electrical contacts with the external electrical contacts of the interposer. The aperture is divided into at least two openings or aperture regions, separated by a bridge. This facilitates the handling of the interposer.
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