Sensor module and method of manufacturing same

United States of America Patent

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Nov 4, 2008
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Aug 25, 2006
filing date
Aug 25, 2006

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Abstract

The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.

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Patent Owner	Address
INFINEON TECHNOLOGIES AG	AM CAMPEON 1-15 NEUBIBERG 85579

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Theuss, Horst	Wenzenbach, DE	233	3067

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Sensor module and method of manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11467474

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US Family Size	Non-US Coverage
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DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 04, 2008	US,7445959,B2 US7445959B2	GRANTED PATENT AS SECOND PUBLICATION
June 05, 2008	US,20080128838,A1 US20080128838A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7445959
SERIAL NO	11467474
DOCKET NO

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11467474

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