Stacked integrated circuits package system with dense routability and high thermal conductivity
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United States of America Patent
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Nov 4, 2008
Issued Date -
N/A
app pub date -
Dec 16, 2005
filing date -
Feb 10, 2005
priority date (Note) -
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Abstract
A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.
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