Semiconductor chip assembly with welded metal pillar of stacked metal balls
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United States of America Patent
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Nov 4, 2008
Grant Date -
N/A
app pub date -
Oct 26, 2006
filing date -
Nov 10, 2004
priority date (Note) -
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Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line and includes stacked metal balls that are welded together.
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