Apparatus and method for automated stress testing of flip-chip packages
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United States of America Patent
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Nov 4, 2008
Grant Date -
Sep 21, 2006
app pub date -
Mar 3, 2006
filing date -
Mar 4, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for testing flip-chip packages has a programmed computer, a test-engine stage for applying an impact to at least one package under test, and a monitoring stage. The test-engine stage causes an impact on the package on the side opposite its ball-grid array. The test-engine stage has actuators connected to the test-engine stage and the computer, for moving and aligning the test-engine stage. The monitoring stage has a digital camera connected to the computer for transmitting digital images from the ball-grid array side of the package to the computer. A microscope is preferably connected to the digital camera. A sample stage located between the test-engine stage and the monitoring stage holds the package under test. The sample stage has an acoustic transducer capable of being removably connected to the package under test. The acoustic transducer is connected to the computer for transmitting signals from the acoustic transducer to the computer.
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