US Patent No: 7,447,037

Number of patents in Portfolio can not be more than 2000

Single chip USB packages by various assembly methods

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ALSO PUBLISHED AS: 20080020641
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SUPER TALENT ELECTRONICS, INC.SAN JOSE, CA221

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiew, Siew S San Jose, CA 42 184
Ma, Abraham C Fremont, CA 200 1179
Ni, Jim Chin-Nan San Jose, CA 95 485
Shen, Ming-Shiang Taipei Hsien, TW 185 927

Cited Art

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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
DIGITAL HARD COPY (1)
D666201 Digital storage medium 3 2011
 
HANA MICRON CO., LTD. (1)
7,709,946 Micro universal serial bus (USB) memory package 7 2006
 
TRANSCEND INFORMATION, INC. (1)
7,554,814 Portable storage device having a sandwich package structure 1 2007
 
WALTON ADVANCED ENGINEERING INC. (1)
8,422,237 Folding structure 0 2010
 
YU GE WEI INTERNATIONAL CORP. (1)
8,059,414 Miniature portable memory device 2 2009

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