Apparatus and method of forming a photoresist pattern, and repair nozzle
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United States of America Patent
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Nov 4, 2008
Grant Date -
May 26, 2005
app pub date -
Oct 6, 2004
filing date -
Oct 8, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
In an apparatus and a method of forming a photoresist pattern, a photoresist-coating section coats a substrate with a photoresist composition to form a photoresist film. A light is irradiated onto the photoresist film by using an exposure section, and a developing section develops the photoresist film. A residue-sensing section senses a residue of the developed photoresist film to generate information of the residue corresponding to the sensed residue. A residue-removing section sprays a solvent in a region of the residue corresponding to the information of the residue to dissolve the residue, and the residue-removing section absorbs the residue dissolved by the solvent. Therefore, the residue is effectively removed by spraying the solvent in the region of the residue and absorbing the residue dissolved by the solvent.
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