Preferential via exit structures with triad configuration for printed circuit boards
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United States of America Patent
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-
Nov 11, 2008
Grant Date -
Sep 15, 2005
app pub date -
Feb 14, 2005
filing date -
Feb 13, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.
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