Curing resin, method for producing same and curing resin composition
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United States of America Patent
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Nov 11, 2008
Grant Date -
Apr 13, 2006
app pub date -
Feb 16, 2004
filing date -
Feb 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule, thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.
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