Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads
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United States of America Patent
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-
Nov 18, 2008
Grant Date -
Jun 12, 2008
app pub date -
Dec 8, 2006
filing date -
Dec 8, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In one embodiment, an interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly. Each conductive contact pad has a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is also disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps.
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