Wafer curvature estimation, monitoring, and compensation
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United States of America Patent
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Nov 18, 2008
Grant Date -
Oct 26, 2006
app pub date -
Mar 30, 2005
filing date -
Mar 30, 2005
priority date (Note) -
Expired
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Abstract
A method of determining wafer curvature in real-time is presented. The method includes establishing a first temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones. The method further includes positioning a wafer at a first height above the hotplate surface and determining a second temperature profile for the hotplate surface. The wafer curvature is then determined by using the second temperature profile. Also, a dynamic model of a processing system is presented and wafer curvature can be incorporated into the dynamic model.
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