Circuit device
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United States of America Patent
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Nov 18, 2008
Issued Date -
N/A
app pub date -
Mar 29, 2006
filing date -
Mar 29, 2005
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.
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