Electrical contactor, especially wafer level contactor, using fluid pressure
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United States of America Patent
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Nov 25, 2008
Grant Date -
Dec 13, 2007
app pub date -
Mar 26, 2007
filing date -
Aug 17, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interconnect assembly can include a semiconductor device that is to be tested, and the semiconductor device can include compliant, elongate contact structures that provide an electrical interface to the semiconductor device. The interconnect assembly can also include a flexible wiring substrate, which can have electrical connections to a semiconductor tester. The flexible wiring substrate can also include electrically conductive contact features located on the substrate in a pattern that corresponds to the elongate contact structures of the semiconductor device to be tested. The flexible wiring substrate can also include wiring that interconnects the probes to the electrical connections to the semiconductor tester. The semiconductor device can be located such that some of the elongate contact structures of the semiconductor device are near some of the conductive contact features of the substrate.
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