Semiconductor apparatus, LED print head, and printer
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United States of America Patent
Stats
-
Nov 25, 2008
Grant Date -
Jun 16, 2005
app pub date -
Nov 30, 2004
filing date -
Dec 4, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.
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