Memory module assembly including a clip for mounting a heat sink thereon
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United States of America Patent
Stats
-
Nov 25, 2008
Grant Date -
Aug 23, 2007
app pub date -
Jul 13, 2006
filing date -
Feb 22, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.
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