Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler
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United States of America Patent
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Dec 2, 2008
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N/A
app pub date -
Nov 27, 2006
filing date -
Nov 20, 2003
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Abstract
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line is adjacent to the bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.
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