Method of manufacturing an encapsulated package for a magnetic device
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United States of America Patent
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Dec 9, 2008
Grant Date -
May 11, 2006
app pub date -
Nov 10, 2004
filing date -
Nov 10, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
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