Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
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United States of America Patent
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-
Dec 9, 2008
Issued Date -
N/A
app pub date -
Nov 14, 1997
filing date -
Nov 20, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO.sub.2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
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