Sound insulation/absorption structure, and structure having these applied thereto

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United States of America Patent

PATENT NO 7464790
APP PUB NO 20060152108A1
SERIAL NO

10562924

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sound insulation/absorption structure, a sound insulation/absorption device, and a structure having these applied thereto and a member constituting the same, are capable of insulating or absorbing sound by stiffness control. The sound insulation/absorption structure comprises a film member, such as a polymer film or metal foil, and a frame body having at least one annular opening, the film member being fixed to the frame body, the section of the film member surrounded by the frame body being of a curved shape such as a dome, wherein the resonance frequency of the in-plane stretching of this curved shape is set at a frequency equal to or higher than the audible frequency band, so as to insulate or absorb sound by the elastic force of the film. The film member may be replaced by an acrylic, polyethylene terephthalate or other plastic plate, an aluminum or other metal plate, or a veneer or other plate member, molded into a curved shape, such as a dome, a semi-cylinder and a cone.

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Patent Owner(s)

Patent OwnerAddress
RION CO LTD20-41 HIGASHIMOTOMACHI 3-CHOME KOKUBUNJI-SHI TOKYO 185-8533
KOBAYASHI INSTITUTE OF PHYSICAL RESEARCH20-41 HIGASHI-MOTOMACHI 3-CHOME KOKUBUNJI-SHI TOKYO 185-8533

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Date, Munehiro Tokyo, JP 14 151
Fukada, Eiichi Tokyo, JP 5 65
Kimura, Kazunori Tokyo, JP 11 142
Kodama, Hidekazu Tokyo, JP 10 241
Mokry, Pavel Tokyo, JP 1 8
Okubo, Tomonao Tokyo, JP 2 8

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