Resistance welded solder crimp for joining stranded wire to a copper lead-frame
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United States of America Patent
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Dec 16, 2008
Issued Date -
N/A
app pub date -
Oct 3, 2006
filing date -
Oct 4, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of connecting stranded wire to a lead-frame body 10 includes the provision of a stranded wire 12. It is ensured that insulation is stripped from an end 14 of the stranded wire. An electrically conductive lead-frame connection structure 16 is associated with the lead-frame body. The end 14 of the stranded wire is inserted into the lead-frame connection structure 16 so that the lead-frame connection structure substantially surrounds the wire end. Solder flux is injected so as to be substantially about a portion of the end of the stranded wire. The lead-frame connection structure is placed in contact with a bottom resistance welding electrode 18 or a top resistance welding electrode 20. The electrode that is not presently in contact with the lead-frame connection structure is moved so as to contact the lead-frame connection structure to resistance weld the wire end 14 to the lead-frame connection structure 16 and thereby define a solder crimp connection 22 of the wire end and the lead-frame connection structure.
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