Stackable micropackages and stacked modules
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United States of America Patent
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Dec 23, 2008
Grant Date -
Apr 24, 2008
app pub date -
Mar 6, 2007
filing date -
Oct 20, 2006
priority date (Note) -
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Abstract
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.
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