Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
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United States of America Patent
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Dec 23, 2008
Grant Date -
Sep 21, 2006
app pub date -
May 3, 2006
filing date -
May 3, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed of a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.
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