Multi-substrate package assembly
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United States of America Patent
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Dec 30, 2008
Grant Date -
Nov 23, 2006
app pub date -
May 15, 2006
filing date -
Mar 18, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.
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