Substrate processing apparatus and substrate processing method

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United States of America Patent

PATENT NO 7476290
APP PUB NO 20050092351A1
SERIAL NO

10695826

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate. The cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0.1 m/s.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Kenya Tokyo, JP 114 1765
Kamezawa, Masayuki Tokyo, JP 6 104
Saito, Takayuki Fujisawa , JP 172 2014
Suzuki, Tsukuru Fujisawa, JP 27 228
Yamada, Kaoru Fujisawa, JP 30 314
Yamaguchi, Kenji Tokyo , JP 154 1460

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