Method of manufacture for microelectromechanical devices
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United States of America Patent
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Jan 13, 2009
Grant Date -
Nov 10, 2005
app pub date -
May 4, 2004
filing date -
May 4, 2004
priority date (Note) -
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Abstract
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
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