Method of packaging a device using a dielectric layer
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United States of America Patent
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Jan 13, 2009
Grant Date -
May 22, 2008
app pub date -
Nov 17, 2006
filing date -
Nov 17, 2006
priority date (Note) -
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Abstract
A method is for packaging a first device having a first major surface and a second major surface. An encapsulant is formed over a second major surface of the first device and around sides of the first device. This leaves the first major surface of the first device exposed. A first dielectric layer is formed over the first major surface of the first device. a side contact interface is formed having at least a portion over the first dielectric layer. The encapsulant is cut to form a plurality of sides of encapsulant. A portion of the encapsulant is removed along a first side of the plurality of sides to expose a portion of the side contact interface along the first side of the plurality of sides.
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