Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
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United States of America Patent
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Jan 20, 2009
Grant Date -
Aug 14, 2008
app pub date -
Apr 8, 2008
filing date -
Nov 10, 1999
priority date (Note) -
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Abstract
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
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