Boost spring holder for securing a power device to a heatsink
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United States of America Patent
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Jan 20, 2009
Grant Date -
Jun 12, 2008
app pub date -
Dec 12, 2006
filing date -
Dec 12, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.
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