Heat dissipation apparatus utilizing empty component slot
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United States of America Patent
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Jan 20, 2009
Grant Date -
Apr 17, 2008
app pub date -
Oct 13, 2006
filing date -
Oct 13, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.
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