Nanoparticle filled underfill
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United States of America Patent
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Jan 27, 2009
Grant Date -
May 8, 2008
app pub date -
Jan 11, 2008
filing date -
May 23, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
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