Exposure method, substrate stage, exposure apparatus, and device manufacturing method

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United States of America Patent

PATENT NO 7483119
APP PUB NO 20060139614A1
SERIAL NO

11297324

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Abstract

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In exposing substrate by projecting an image of a pattern onto substrate via projection optical system and liquid, side surface and underside surface of substrate are applied with liquid-repellent treatment. By such a configuration, an exposure method by which when exposing edge areas of the substrate, the exposure can be performed in a condition that a liquid immersion region is formed well and that flowing out of the liquid to the outside of the substrate stage are prevented is provided.

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Patent Owner(s)

Patent OwnerAddress
NIKON CORPORATIONTOKYO 140-8601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirukawa, Shigeru Tokyo, JP 94 4026
Inoue, Jiro Kumagaya, JP 113 1497
Kudo, Yoshihiko Tokyo, JP 26 348
Magome, Nobutaka Kumagaya, JP 97 3606
Nagasaka, Hiroyuki Kumagaya, JP 178 2616
Owa, Soichi Kumagaya , JP 110 2777

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