Drop resistant bumpers for fully molded memory cards
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United States of America Patent
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-
Feb 3, 2009
Grant Date -
N/A
app pub date -
Jun 26, 2003
filing date -
Sep 19, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A memory card comprising a leadframe having a plurality of contacts, at least one die pad, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. Also included in the leadframe are at least two bumpers. Attached to the die pad is a semiconductor die which is electrically connected to at least one of the traces. A body defining at least two corner regions at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body, and the bumpers are located at respective ones of the corner regions thereof.
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