US Patent No: 7,488,618

Number of patents in Portfolio can not be more than 2000

Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same

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ALSO PUBLISHED AS: 20060134827
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one microprocessor and a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor. At least one microlens in the array includes a plurality of mutually adhered layers of cured optically transmissive material.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18599

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benson, Peter A Guilderland, NY 55 305
Farnworth, Warren M Nampa, ID 907 23428
Watkins, Charles M Eagle, ID 124 887
Wood, Alan G Boise, ID 449 15772

Cited Art

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MICRON TECHNOLOGY, INC. (49)
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6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices 214 2000
6,569,753 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same 31 2000
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6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 31 2000
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6,399,464 Packaging die preparation 19 2000
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6,908,784 Method for fabricating encapsulated semiconductor components 143 2002
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6,734,032 Method and apparatus for marking a bare semiconductor die 16 2002
6,764,935 Stereolithographic methods for fabricating conductive elements 8 2002
6,833,627 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 11 2002
7,043,830 Method of forming conductive bumps 16 2003
6,897,096 Method of packaging semiconductor dice employing at least one redistribution layer 23 2003
6,746,899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 12 2003
6,780,744 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components 8 2003
6,963,127 Protective structures for bond wires 6 2003
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure 21 2003
2005/0064,683 Method and apparatus for supporting wafers for die singulation and subsequent handling 19 2003
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7,112,471 Leadless packaging for image sensor devices and methods of assembly 15 2003
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2005/0277,231 Underfill and encapsulation of semicondcutor assemblies with materials having differing properties and methods of fabrication using stereolithography 13 2004
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MOTOROLA, INC. (6)
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MOSAID TECHNOLOGIES INCORPORATED (4)
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OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
INTEL CORPORATION (1)
7,589,395 Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation 0 2006
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,605,857 Methods of manufacturing microlenses, microlens arrays and image sensors 0 2006
 
WUU, DONG-SING (1)
7,740,376 Flexible light emitting module 1 2007

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