Semiconductor wafer assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 10, 2009
Grant Date -
Aug 31, 2006
app pub date -
Apr 27, 2006
filing date -
Apr 29, 2004
priority date (Note) -
Expired
status (Latency Note)
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Importance

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Abstract
An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | Total Patents |
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MICRON TECHNOLOGY, INC. | BOISE, ID | 19439 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Benson, Peter A | Boise , US | 43 | 952 |
Cited Art Landscape
Patent Info | (Count) | # Cites | Year |
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2002/0091,173 Re-release adhesive and re-release adhesive sheet | 10 | 2001 | |
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6344402 Method of dicing workpiece | 73 | 2000 | |
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5803797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck | 38 | 1996 | |
5953590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck | 28 | 1997 | |
6140151 Semiconductor wafer processing method | 70 | 1998 | |
6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 12 | 2000 | |
6303469 Thin microelectronic substrates and methods of manufacture | 39 | 2000 | |
6326698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices | 249 | 2000 | |
* 6461881 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | 44 | 2000 | |
6537482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography | 36 | 2000 | |
6432752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 40 | 2000 | |
6524881 Method and apparatus for marking a bare semiconductor die | 29 | 2000 | |
6245646 Film frame substrate fixture | 20 | 2000 | |
6399464 Packaging die preparation | 19 | 2000 | |
6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 16 | 2001 | |
6593171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 41 | 2002 | |
6908784 Method for fabricating encapsulated semiconductor components | 219 | 2002 | |
6734032 Method and apparatus for marking a bare semiconductor die | 19 | 2002 | |
6683378 System for singulating semiconductor components utilizing alignment pins | 7 | 2003 | |
6746899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 12 | 2003 | |
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure | 30 | 2003 | |
2005/0064,683 Method and apparatus for supporting wafers for die singulation and subsequent handling | 23 | 2003 | |
6940181 Thinned, strengthened semiconductor substrates and packages including same | 22 | 2003 | |
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5268065 Method for thinning a semiconductor wafer | 67 | 1992 | |
5703493 Wafer holder for semiconductor applications | 26 | 1995 | |
6150240 Method and apparatus for singulating semiconductor devices | 22 | 1998 | |
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5869354 Method of making dielectrically isolated integrated circuit | 80 | 1994 | |
5824457 Use of WEE (wafer edge exposure) to prevent polyimide contamination | 16 | 1996 | |
5723385 Wafer edge seal ring structure | 22 | 1996 | |
6033589 Method for depositing a coating layer on a wafer without edge bead formation | 9 | 1997 | |
6040248 Chemistry for etching organic low-k materials | 47 | 1998 | |
6042976 Method of calibrating WEE exposure tool | 21 | 1999 | |
6114253 Via patterning for poly(arylene ether) used as an inter-metal dielectric | 13 | 1999 | |
6736896 Gas spray arm for spin coating apparatus | 5 | 2002 | |
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6039830 Method of and apparatus for laminating a semiconductor wafer with protective tape | 21 | 1998 | |
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7118938 Method for packaging a multi-chip module of a semiconductor device | 5 | 2003 | |
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5705016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet | 46 | 1995 | |
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6462273 Semiconductor card and method of fabrication | 90 | 2001 | |
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6582983 Method and wafer for maintaining ultra clean bonding pads on a wafer | 113 | 2002 | |
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6465329 Microcircuit die-sawing protector and method | 29 | 1999 | |
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6143590 Multi-chip semiconductor device and method of producing the same | 21 | 1999 | |
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5827394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing | 36 | 1997 | |
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5547906 Methods for producing integrated circuit devices | 120 | 1994 | |
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6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | 51 | 2001 | |
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6551906 Method of fabricating semiconductor device | 33 | 2000 | |
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5675402 Stepper light control using movable blades | 17 | 1995 | |
6339255 Stacked semiconductor chips in a single semiconductor package | 204 | 1999 | |
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5843527 Coating solution applying method and apparatus | 41 | 1996 | |
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6462401 Semiconductor wafer having a bank on a scribe line | 12 | 2001 | |
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2001/0055,834 Method of making semiconductor packages at wafer level | 7 | 2001 | |
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5610683 Immersion type projection exposure apparatus | 964 | 1995 | |
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6259962 Apparatus and method for three dimensional model printing | 231 | 1999 | |
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6322598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices | 20 | 1999 | |
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5833869 Method for etching photolithographically produced quartz crystal blanks for singulation | 13 | 1997 | |
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6489042 Photoimageable dielectric material for circuit protection | 7 | 2001 | |
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6472294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices | 15 | 2001 | |
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5121256 Lithography system employing a solid immersion lens | 512 | 1991 | |
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2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer | 14 | 2003 | |
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6680241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | 16 | 2000 | |
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6974721 Method for manufacturing thin semiconductor chip | 6 | 2003 | |
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6268584 Multiple beams and nozzles to increase deposition rate | 129 | 1998 | |
6251488 Precision spray processes for direct write electronic components | 170 | 1999 | |
6391251 Forming structures from CAD solid models | 303 | 2000 | |
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4925515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape | 46 | 1988 | |
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6506688 Method for removing photoresist layer on wafer edge | 11 | 2001 | |
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6468832 Method to encapsulate bumped integrated circuit to create chip scale package | 32 | 2000 | |
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2002/0171,177 System and method for printing and supporting three dimensional objects | 107 | 2002 | |
2003/0151,167 Device, system and method for accurate printing of three dimensional objects | 115 | 2003 | |
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5460703 Low thermal expansion clamping mechanism | 29 | 1994 | |
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6621161 Semiconductor device having a package structure | 19 | 2001 | |
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6413150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate | 17 | 2000 | |
6471806 Method of adhering a wafer to wafer tape | 14 | 2000 | |
6686225 Method of separating semiconductor dies from a wafer | 51 | 2001 | |
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5919520 Coating method and apparatus for semiconductor process | 62 | 1997 | |
6749688 Coating method and apparatus for semiconductor process | 26 | 1999 | |
6284044 Film forming method and film forming apparatus | 16 | 2000 |
Patent Citation Ranking
Forward Cite Landscape
Patent Info | (Count) | # Cites | Year |
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9589842 Semiconductor package and method of fabricating the same | 0 | 2016 |
Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 10, 2020 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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