US Patent No: 7,489,020
Number of patents in Portfolio can not be more than 2000
Semiconductor wafer assemblies
ALSO PUBLISHED AS:
20060192283
Stats
-
Feb 10, 2009
Issued date -
Apr 27, 2006
filing date -
11/413,415
serial no -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.
Loading the Abstract Image...
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
|
|
|||
| 5,803,797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck | 34 | 1996 | |
| 5,953,590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck | 26 | 1997 | |
| 6,140,151 Semiconductor wafer processing method | 58 | 1998 | |
| 6,740,962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 12 | 2000 | |
| 6,303,469 Thin microelectronic substrates and methods of manufacture | 36 | 2000 | |
| 6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices | 231 | 2000 | |
| * 6,461,881 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | 41 | 2000 | |
| 6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography | 33 | 2000 | |
| 6,432,752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 40 | 2000 | |
| 6,524,881 Method and apparatus for marking a bare semiconductor die | 29 | 2000 | |
| 6,245,646 Film frame substrate fixture | 20 | 2000 | |
| 6,399,464 Packaging die preparation | 19 | 2000 | |
| 6,562,661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 16 | 2001 | |
| 6,593,171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 41 | 2002 | |
| 6,908,784 Method for fabricating encapsulated semiconductor components | 174 | 2002 | |
| 6,734,032 Method and apparatus for marking a bare semiconductor die | 19 | 2002 | |
| 6,683,378 System for singulating semiconductor components utilizing alignment pins | 7 | 2003 | |
| 6,746,899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 12 | 2003 | |
| 2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure | 26 | 2003 | |
| 2005/0064,683 Method and apparatus for supporting wafers for die singulation and subsequent handling | 19 | 2003 | |
| 6,940,181 Thinned, strengthened semiconductor substrates and packages including same | 18 | 2003 | |
|
|
|||
| 5,869,354 Method of making dielectrically isolated integrated circuit | 72 | 1994 | |
| 5,824,457 Use of WEE (wafer edge exposure) to prevent polyimide contamination | 15 | 1996 | |
| 5,723,385 Wafer edge seal ring structure | 21 | 1996 | |
| 6,033,589 Method for depositing a coating layer on a wafer without edge bead formation | 9 | 1997 | |
| 6,040,248 Chemistry for etching organic low-k materials | 45 | 1998 | |
| 6,042,976 Method of calibrating WEE exposure tool | 19 | 1999 | |
| 6,114,253 Via patterning for poly(arylene ether) used as an inter-metal dielectric | 12 | 1999 | |
| 6,736,896 Gas spray arm for spin coating apparatus | 5 | 2002 | |
|
|
|||
| 5,268,065 Method for thinning a semiconductor wafer | 67 | 1992 | |
| 5,703,493 Wafer holder for semiconductor applications | 22 | 1995 | |
| 6,150,240 Method and apparatus for singulating semiconductor devices | 21 | 1998 | |
|
|
|||
| 6,259,962 Apparatus and method for three dimensional model printing | 181 | 1999 | |
| 2002/0171,177 System and method for printing and supporting three dimensional objects | 94 | 2002 | |
| 2003/0151,167 Device, system and method for accurate printing of three dimensional objects | 100 | 2003 | |
|
|
|||
| 6,268,584 Multiple beams and nozzles to increase deposition rate | 112 | 1998 | |
| 6,251,488 Precision spray processes for direct write electronic components | 153 | 1999 | |
| 6,391,251 Forming structures from CAD solid models | 194 | 2000 | |
|
|
|||
| 6,413,150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate | 15 | 2000 | |
| 6,471,806 Method of adhering a wafer to wafer tape | 14 | 2000 | |
| 6,686,225 Method of separating semiconductor dies from a wafer | 29 | 2001 | |
|
|
|||
| 5,919,520 Coating method and apparatus for semiconductor process | 60 | 1997 | |
| 6,749,688 Coating method and apparatus for semiconductor process | 24 | 1999 | |
| 6,284,044 Film forming method and film forming apparatus | 16 | 2000 | |
|
|
|||
| 5,675,402 Stepper light control using movable blades | 17 | 1995 | |
| 6,339,255 Stacked semiconductor chips in a single semiconductor package | 174 | 1999 | |
|
|
|||
| 2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer | 14 | 2003 | |
|
|
|||
| 6,489,042 Photoimageable dielectric material for circuit protection | 6 | 2001 | |
|
|
|||
| 2001/0055,834 Method of making semiconductor packages at wafer level | 7 | 2001 | |
|
|
|||
| 6,465,329 Microcircuit die-sawing protector and method | 27 | 1999 | |
|
|
|||
| 5,460,703 Low thermal expansion clamping mechanism | 28 | 1994 | |
|
|
|||
| 5,610,683 Immersion type projection exposure apparatus | 690 | 1995 | |
|
|
|||
| 5,833,869 Method for etching photolithographically produced quartz crystal blanks for singulation | 13 | 1997 | |
|
|
|||
| 6,344,402 Method of dicing workpiece | 57 | 2000 | |
|
|
|||
| 7,118,938 Method for packaging a multi-chip module of a semiconductor device | 5 | 2003 | |
|
|
|||
| 6,680,241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | 16 | 2000 | |
|
|
|||
| 6,143,590 Multi-chip semiconductor device and method of producing the same | 20 | 1999 | |
|
|
|||
| 6,472,294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices | 15 | 2001 | |
|
|
|||
| 6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | 48 | 2001 | |
|
|
|||
| 6,582,983 Method and wafer for maintaining ultra clean bonding pads on a wafer | 42 | 2002 | |
|
|
|||
| 6,551,906 Method of fabricating semiconductor device | 32 | 2000 | |
|
|
|||
| 5,705,016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet | 41 | 1995 | |
|
|
|||
| 6,506,688 Method for removing photoresist layer on wafer edge | 10 | 2001 | |
|
|
|||
| 6,621,161 Semiconductor device having a package structure | 16 | 2001 | |
|
|
|||
| 6,468,832 Method to encapsulate bumped integrated circuit to create chip scale package | 24 | 2000 | |
|
|
|||
| 6,462,401 Semiconductor wafer having a bank on a scribe line | 11 | 2001 | |
|
|
|||
| 2002/0091,173 Re-release adhesive and re-release adhesive sheet | 9 | 2001 | |
|
|
|||
| 6,322,598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices | 19 | 1999 | |
|
|
|||
| 6,039,830 Method of and apparatus for laminating a semiconductor wafer with protective tape | 18 | 1998 | |
|
|
|||
| 5,843,527 Coating solution applying method and apparatus | 40 | 1996 | |
|
|
|||
| 6,974,721 Method for manufacturing thin semiconductor chip | 6 | 2003 | |
|
|
|||
| 6,462,273 Semiconductor card and method of fabrication | 78 | 2001 | |
|
|
|||
| 4,925,515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape | 44 | 1988 | |
|
|
|||
| 5,547,906 Methods for producing integrated circuit devices | 102 | 1994 | |
|
|
|||
| 5,121,256 Lithography system employing a solid immersion lens | 383 | 1991 | |
|
|
|||
| 5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing | 35 | 1997 | |
* Cited By Examiner
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 10, 2016 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 10, 2020 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |