Semiconductor wafer assemblies

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7489020
APP PUB NO 20060192283A1
SERIAL NO

11413415

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19439

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benson, Peter A Boise , US 43 952

Cited Art Landscape

Patent Info (Count) # Cites Year
 
NITTO DENKO CORPORATION (1)
2002/0091,173 Re-release adhesive and re-release adhesive sheet 10 2001
 
DISCO CORPORATION (1)
6344402 Method of dicing workpiece 73 2000
 
MICRON TECHNOLOGY, INC. (21)
5803797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck 38 1996
5953590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 28 1997
6140151 Semiconductor wafer processing method 70 1998
6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 12 2000
6303469 Thin microelectronic substrates and methods of manufacture 39 2000
6326698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices 249 2000
* 6461881 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures 44 2000
6537482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 36 2000
6432752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 40 2000
6524881 Method and apparatus for marking a bare semiconductor die 29 2000
6245646 Film frame substrate fixture 20 2000
6399464 Packaging die preparation 19 2000
6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 16 2001
6593171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 41 2002
6908784 Method for fabricating encapsulated semiconductor components 219 2002
6734032 Method and apparatus for marking a bare semiconductor die 19 2002
6683378 System for singulating semiconductor components utilizing alignment pins 7 2003
6746899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 12 2003
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure 30 2003
2005/0064,683 Method and apparatus for supporting wafers for die singulation and subsequent handling 23 2003
6940181 Thinned, strengthened semiconductor substrates and packages including same 22 2003
 
FREESCALE SEMICONDUCTOR, INC. (3)
5268065 Method for thinning a semiconductor wafer 67 1992
5703493 Wafer holder for semiconductor applications 26 1995
6150240 Method and apparatus for singulating semiconductor devices 22 1998
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8)
5869354 Method of making dielectrically isolated integrated circuit 80 1994
5824457 Use of WEE (wafer edge exposure) to prevent polyimide contamination 16 1996
5723385 Wafer edge seal ring structure 22 1996
6033589 Method for depositing a coating layer on a wafer without edge bead formation 9 1997
6040248 Chemistry for etching organic low-k materials 47 1998
6042976 Method of calibrating WEE exposure tool 21 1999
6114253 Via patterning for poly(arylene ether) used as an inter-metal dielectric 13 1999
6736896 Gas spray arm for spin coating apparatus 5 2002
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6039830 Method of and apparatus for laminating a semiconductor wafer with protective tape 21 1998
 
DSS TECHNOLOGY MANAGEMENT, INC. (1)
7118938 Method for packaging a multi-chip module of a semiconductor device 5 2003
 
LINTEC CORPORATION (1)
5705016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet 46 1995
 
SIEMENS COMMUNICATIONS, INC. (1)
6462273 Semiconductor card and method of fabrication 90 2001
 
Keteca Singapore Singapore (1)
6582983 Method and wafer for maintaining ultra clean bonding pads on a wafer 113 2002
 
AMKOR TECHNOLOGY, INC. (1)
6465329 Microcircuit die-sawing protector and method 29 1999
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6143590 Multi-chip semiconductor device and method of producing the same 21 1999
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
5827394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 36 1997
 
TESSERA TECHNOLOGIES HUNGARY KFT. (1)
5547906 Methods for producing integrated circuit devices 120 1994
 
INVENSAS CORPORATION (1)
6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 51 2001
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
6551906 Method of fabricating semiconductor device 33 2000
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
5675402 Stepper light control using movable blades 17 1995
6339255 Stacked semiconductor chips in a single semiconductor package 204 1999
 
SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD. (1)
5843527 Coating solution applying method and apparatus 41 1996
 
NEC ELECTRONICS CORPORATION (1)
6462401 Semiconductor wafer having a bank on a scribe line 12 2001
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
2001/0055,834 Method of making semiconductor packages at wafer level 7 2001
 
CANON KABUSHIKI KAISHA (1)
5610683 Immersion type projection exposure apparatus 964 1995
 
STRATASYS LTD. (1)
6259962 Apparatus and method for three dimensional model printing 231 1999
 
QUALCOMM INCORPORATED (1)
6322598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices 20 1999
 
CTS CORPORATION (1)
5833869 Method for etching photolithographically produced quartz crystal blanks for singulation 13 1997
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6489042 Photoimageable dielectric material for circuit protection 7 2001
 
IMEC (1)
6472294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices 15 2001
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
5121256 Lithography system employing a solid immersion lens 512 1991
 
3D SYSTEMS, INC. (1)
2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer 14 2003
 
FUJITSU LIMITED (1)
6680241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices 16 2000
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6974721 Method for manufacturing thin semiconductor chip 6 2003
 
OPTOMEC DESIGN COMPANY (3)
6268584 Multiple beams and nozzles to increase deposition rate 129 1998
6251488 Precision spray processes for direct write electronic components 170 1999
6391251 Forming structures from CAD solid models 303 2000
 
Takatori Hitech Co., Ltd. (1)
4925515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape 46 1988
 
MACRONIX INTERNATIONAL CO., LTD. (1)
6506688 Method for removing photoresist layer on wafer edge 11 2001
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
6468832 Method to encapsulate bumped integrated circuit to create chip scale package 32 2000
 
OBJET GEOMETRIES LTD. (2)
2002/0171,177 System and method for printing and supporting three dimensional objects 107 2002
2003/0151,167 Device, system and method for accurate printing of three dimensional objects 115 2003
 
APPLIED MATERIALS, INC. (1)
5460703 Low thermal expansion clamping mechanism 29 1994
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6621161 Semiconductor device having a package structure 19 2001
 
TEXAS INSTRUMENTS INCORPORATED (3)
6413150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate 17 2000
6471806 Method of adhering a wafer to wafer tape 14 2000
6686225 Method of separating semiconductor dies from a wafer 51 2001
 
TOKYO ELECTRON LIMITED (3)
5919520 Coating method and apparatus for semiconductor process 62 1997
6749688 Coating method and apparatus for semiconductor process 26 1999
6284044 Film forming method and film forming apparatus 16 2000
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SAMSUNG ELECTRONICS CO., LTD. (1)
9589842 Semiconductor package and method of fabricating the same 0 2016
* Cited By Examiner

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 10, 2020
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00