US Patent No: 7,489,020

Number of patents in Portfolio can not be more than 2000

Semiconductor wafer assemblies

ALSO PUBLISHED AS: 20060192283

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Abstract

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An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21303

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benson, Peter A Guilderland, NY 70 458

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (21)
5,803,797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck 33 1996
5,953,590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 25 1997
6,140,151 Semiconductor wafer processing method 58 1998
6,740,962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 12 2000
6,303,469 Thin microelectronic substrates and methods of manufacture 35 2000
6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices 226 2000
6,461,881 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures 40 2000
6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 33 2000
6,432,752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 40 2000
6,524,881 Method and apparatus for marking a bare semiconductor die 28 2000
6,245,646 Film frame substrate fixture 19 2000
6,399,464 Packaging die preparation 19 2000
6,562,661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 16 2001
6,593,171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 41 2002
6,908,784 Method for fabricating encapsulated semiconductor components 165 2002
6,734,032 Method and apparatus for marking a bare semiconductor die 19 2002
6,683,378 System for singulating semiconductor components utilizing alignment pins 7 2003
6,746,899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 12 2003
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure 24 2003
2005/0064,683 Method and apparatus for supporting wafers for die singulation and subsequent handling 19 2003
6,940,181 Thinned, strengthened semiconductor substrates and packages including same 17 2003
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8)
5,869,354 Method of making dielectrically isolated integrated circuit 66 1994
5,824,457 Use of WEE (wafer edge exposure) to prevent polyimide contamination 14 1996
5,723,385 Wafer edge seal ring structure 21 1996
6,033,589 Method for depositing a coating layer on a wafer without edge bead formation 9 1997
6,040,248 Chemistry for etching organic low-k materials 45 1998
6,042,976 Method of calibrating WEE exposure tool 19 1999
6,114,253 Via patterning for poly(arylene ether) used as an inter-metal dielectric 11 1999
6,736,896 Gas spray arm for spin coating apparatus 5 2002
 
FREESCALE SEMICONDUCTOR, INC. (3)
5,268,065 Method for thinning a semiconductor wafer 67 1992
5,703,493 Wafer holder for semiconductor applications 22 1995
6,150,240 Method and apparatus for singulating semiconductor devices 21 1998
 
OBJET GEOMETRIES LTD. (3)
6,259,962 Apparatus and method for three dimensional model printing 171 1999
2002/0171,177 System and method for printing and supporting three dimensional objects 90 2002
2003/0151,167 Device, system and method for accurate printing of three dimensional objects 95 2003
 
OPTOMEC DESIGN COMPANY (3)
6,268,584 Multiple beams and nozzles to increase deposition rate 112 1998
6,251,488 Precision spray processes for direct write electronic components 150 1999
6,391,251 Forming structures from CAD solid models 183 2000
 
TEXAS INSTRUMENTS INCORPORATED (3)
6,413,150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate 14 2000
6,471,806 Method of adhering a wafer to wafer tape 14 2000
6,686,225 Method of separating semiconductor dies from a wafer 26 2001
 
TOKYO ELECTRON LIMITED (3)
5,919,520 Coating method and apparatus for semiconductor process 58 1997
6,749,688 Coating method and apparatus for semiconductor process 22 1999
6,284,044 Film forming method and film forming apparatus 16 2000
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
5,675,402 Stepper light control using movable blades 17 1995
6,339,255 Stacked semiconductor chips in a single semiconductor package 167 1999
 
3D SYSTEMS, INC. (1)
2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer 13 2003
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,489,042 Photoimageable dielectric material for circuit protection 6 2001
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
2001/0055,834 Method of making semiconductor packages at wafer level 7 2001
 
AMKOR TECHNOLOGY, INC. (1)
6,465,329 Microcircuit die-sawing protector and method 26 1999
 
APPLIED MATERIALS, INC. (1)
5,460,703 Low thermal expansion clamping mechanism 28 1994
 
CANON KABUSHIKI KAISHA (1)
5,610,683 Immersion type projection exposure apparatus 639 1995
 
CTS CORPORATION (1)
5,833,869 Method for etching photolithographically produced quartz crystal blanks for singulation 13 1997
 
DISCO CORPORATION (1)
6,344,402 Method of dicing workpiece 51 2000
 
DSS TECHNOLOGY MANAGEMENT, INC. (1)
7,118,938 Method for packaging a multi-chip module of a semiconductor device 5 2003
 
FUJITSU LIMITED (1)
6,680,241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices 16 2000
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,143,590 Multi-chip semiconductor device and method of producing the same 19 1999
 
IMEC (1)
6,472,294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices 15 2001
 
INVENSAS CORPORATION (1)
6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 48 2001
 
Keteca Singapore Singapore (1)
6,582,983 Method and wafer for maintaining ultra clean bonding pads on a wafer 31 2002
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
6,551,906 Method of fabricating semiconductor device 31 2000
 
LINTEC CORPORATION (1)
5,705,016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet 41 1995
 
MACRONIX INTERNATIONAL CO., LTD. (1)
6,506,688 Method for removing photoresist layer on wafer edge 10 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,621,161 Semiconductor device having a package structure 16 2001
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
6,468,832 Method to encapsulate bumped integrated circuit to create chip scale package 23 2000
 
NEC ELECTRONICS CORPORATION (1)
6,462,401 Semiconductor wafer having a bank on a scribe line 11 2001
 
NITTO DENKO CORPORATION (1)
2002/0091,173 Re-release adhesive and re-release adhesive sheet 9 2001
 
QUALCOMM INCORPORATED (1)
6,322,598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices 19 1999
 
RCA Corporation (1)
4,266,334 Manufacture of thinned substrate imagers 49 1979
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,039,830 Method of and apparatus for laminating a semiconductor wafer with protective tape 18 1998
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6,974,721 Method for manufacturing thin semiconductor chip 6 2003
 
SIEMENS COMMUNICATIONS, INC. (1)
6,462,273 Semiconductor card and method of fabrication 76 2001
 
SOKUDO CO., LTD. (1)
5,843,527 Coating solution applying method and apparatus 39 1996
 
Takatori Hitech Co., Ltd. (1)
4,925,515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape 44 1988
 
TESSERA TECHNOLOGIES HUNGARY KFT. (1)
5,547,906 Methods for producing integrated circuit devices 98 1994
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
5,121,256 Lithography system employing a solid immersion lens 364 1991
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 34 1997

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