Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 17, 2009
Grant Date -
Jul 24, 2008
app pub date -
Oct 1, 2007
filing date -
Sep 8, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully