Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
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United States of America Patent
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Feb 24, 2009
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N/A
app pub date -
Dec 26, 2006
filing date -
Dec 26, 2006
priority date (Note) -
Expired
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Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers the chip and the thermal conductor, grinding the encapsulant without grinding the thermal conductor or the chip and then grinding the encapsulant and the thermal conductor without grinding the chip such that the encapsulant and the thermal conductor are laterally aligned.
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