Method of forming a thin wafer stack for a wafer level package
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United States of America Patent
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Feb 24, 2009
Grant Date -
Dec 22, 2005
app pub date -
Jun 2, 2005
filing date -
Jun 22, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.
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