Wafer dividing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 3, 2009
Issued Date -
N/A
app pub date -
Oct 14, 2005
filing date -
Oct 20, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.
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