Method of forming a multi-die semiconductor package
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United States of America Patent
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Mar 3, 2009
Grant Date -
Oct 20, 2005
app pub date -
Jun 27, 2005
filing date -
Aug 22, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Some embodiments of the invention relate to a method of packaging multiple dice into a semiconducting device. The method includes placing a first capsule that includes a first die onto a front side of a tape substrate, placing a second capsule that includes a second die onto the front side of the tape substrate, filling a recess in a surface of the first capsule with an adhesive and folding the tape substrate to attach the first capsule to the second capsule using the adhesive. The method may further include placing a third capsule that includes a third die onto the front side of the tape substrate such that folding the tape substrate includes positioning the third capsule against a back side of the tape substrate opposite to the second capsule.
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