Integrated circuit leadless package system
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United States of America Patent
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Mar 3, 2009
Grant Date -
May 17, 2007
app pub date -
May 4, 2006
filing date -
May 5, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.
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