Measuring and trimming circuit components embedded in micro-platforms
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United States of America Patent
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Mar 17, 2009
Grant Date -
Nov 15, 2007
app pub date -
Jul 24, 2007
filing date -
Sep 23, 2004
priority date (Note) -
Expired
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Abstract
There is described a method and sub-circuit to measure temperature coefficients (coefficient of variation of a measurable parameter of the component), by using a thermally-isolated silicon micro-platform with a mass of mono-crystalline silicon suspended from it. The particular effectiveness of the measurement of temperature coefficient(s) stems from the influence of the mono-crystalline silicon mass in maintaining a substantially uniform temperature throughout the micro-platform. The measurement of temperature coefficient can be an absolute temperature coefficient of one or more components, or can be a relative temperature coefficient of two components, or can be relative temperature coefficients between more than two components.
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