Substrate based unmolded package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 17, 2009
Grant Date -
Jan 5, 2006
app pub date -
Jul 12, 2005
filing date -
Aug 30, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully