Packaging of a microchip device
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United States of America Patent
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Mar 17, 2009
Grant Date -
Jan 18, 2007
app pub date -
Sep 21, 2006
filing date -
Jun 19, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically contacting the packaged microchip device and to be electrically connected with the microchip device. There is an aperture extending from the outer side into the interposer. The aperture may be divided into at least two openings, and at least a first of the openings may extend from the outer side through the interposer in order to allow connection to the microchip device.
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