Package for sealing an integrated circuit die
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United States of America Patent
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-
Mar 24, 2009
Grant Date -
Dec 8, 2005
app pub date -
Jun 28, 2005
filing date -
Jun 6, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
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