Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
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United States of America Patent
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Mar 24, 2009
Grant Date -
Nov 16, 2006
app pub date -
Mar 9, 2004
filing date -
Mar 11, 2003
priority date (Note) -
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Abstract
The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.
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