Compact high output power mid-infrared emitter system and method
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United States of America Patent
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Mar 24, 2009
Grant Date -
Aug 30, 2007
app pub date -
Mar 28, 2005
filing date -
Mar 26, 2004
priority date (Note) -
Expired
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Abstract
A mid-infrared emitter sub-system includes a heat sink and a diamond thermal diffusion layer connected to the heat sink through a first thermal bonding layer. The first thermal bonding layer has a first melting point. A semiconductor slab portion of a semiconductor laser is connected to the diamond thermal diffusion layer through a second thermal bonding layer. The second thermal bonding layer has a second melting point that is less than the first melting point.
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