Process for manufacturing device having honeycomb-structure thermal barrier coating
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United States of America Patent
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Mar 31, 2009
Grant Date -
Sep 29, 2005
app pub date -
Dec 8, 2004
filing date -
May 16, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A process for manufacturing a device adapted for exposure to high temperatures. A support structure for retaining a ceramic insulating material on a substrate is formed by the deposition of a support structure material through a patterned masking material. The support structure can define cells into which the ceramic insulating material is deposited following removal of the masking material. The support structure may be a composite metal-ceramic material having either discreet layers or a graded composition deposited by an electro-deposition process followed by a heat treatment to form a solid state diffusion bond with the substrate. The ceramic filler material may be deposited by the electrophoretic deposition of ceramic particles coated with a bonding material that is subsequently heated to oxidize and to bond the particles together. The support structure may be formed with inclined walls in order to improve its resistance to foreign object impact damage.
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